Experience / Intel

Intel

Module Engineering Intern, Cross Module Support

Dates
Sep 2026 – Present
Location
Hillsboro, OR
Focus
Wafer handling and material flow
Tools
SQL, Toad

Overview

This fall I'm a Module Engineering Intern at Intel's Hillsboro site, working in Cross Module Support. The group handles the systems that move wafers between process modules, so my work is less about a single tool and more about keeping material flowing through the whole fab.

What I'm working on

  • Wafer handling and material flow. Supporting the processes that move wafers between modules, alongside the engineers who own them.
  • Troubleshooting. Helping with equipment and process issues, from pulling and reviewing data to checking that fixes actually hold.
  • Verification. Running verification work on changes meant to make wafer movement more reliable.
  • Working across teams. Coordinating with process, equipment, and manufacturing teams, who each look at the same problem differently.

What's new for me

My earlier work was small-scale, where I could see a whole system come together in front of me. A high-volume fab is the opposite: the systems are huge and automated, and small reliability problems add up fast. Contamination control alone changes how you approach almost any hands-on task.

A note on detail

Most of the specifics of fab work are confidential, so this page stays at the level of my resume. I'm happy to talk about the work in more depth where I can.